An enhanced heat sink

A heat sink device for dissipating heat from an electronic component mounted there to, the device comprising: an inlet for receiving a fluid; an outlet for venting said fluid; a heat dissipation zone intermediate the inlet and outlet; said zone including a plurality of transverse channels and a plur...

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Bibliographic Details
Main Authors LEE POH SENG, LEE YONG JIUN
Format Patent
LanguageChinese
English
Published 03.10.2012
Subjects
BLASTING
DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION
HEAT EXCHANGE IN GENERAL
HEATING
LIGHTING
MECHANICAL ENGINEERING
WEAPONS
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Summary:A heat sink device for dissipating heat from an electronic component mounted there to, the device comprising: an inlet for receiving a fluid; an outlet for venting said fluid; a heat dissipation zone intermediate the inlet and outlet; said zone including a plurality of transverse channels and a plurality of oblique channels extending between adjacent transverse channels; wherein said oblique and transverse channels define a fluid path for said fluid from the inlet to the outlet.
Bibliography:Application Number: CN201080055001