Method and products related to deposited particles

The invention concerns a method of removing encapsulating material from encapsulated particles deposited onto a substrate. According to the method, a substrate is used which is capable of facilitating said removal of encapsulating material. The particles may be nanoparticles. In particular, the subs...

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Bibliographic Details
Main Authors MATTILA TOMI, ALLEN MARK, LEPPAENIEMI JAAKKO
Format Patent
LanguageChinese
English
Published 19.09.2012
Subjects
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Summary:The invention concerns a method of removing encapsulating material from encapsulated particles deposited onto a substrate. According to the method, a substrate is used which is capable of facilitating said removal of encapsulating material. The particles may be nanoparticles. In particular, the substrate-facilitated removal may result in sintering of the particles. The invention provides a novel way of functionalizing electronic structures using particulate matter and for conveniently producing e.g. printed electronics devices.
Bibliography:Application Number: CN2010861397