Edge-mounted sensor

The invention relates to an edge-mounted sensor. Sensor packages and methods for making a sensor device package for side mounting on a circuit board are provided. A sensor device(s) in a mechanical layer (25) of silicon is sandwiched between first and second layers (24, 26) of glass to create a wafe...

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Bibliographic Details
Main Author FOSTER MICHAEL
Format Patent
LanguageChinese
English
Published 19.09.2012
Subjects
INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
MEASURING
MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK
PHYSICS
TESTING
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Summary:The invention relates to an edge-mounted sensor. Sensor packages and methods for making a sensor device package for side mounting on a circuit board are provided. A sensor device(s) in a mechanical layer (25) of silicon is sandwiched between first and second layers (24, 26) of glass to create a wafer. A first via(s) (30) is created in the first or second layers to expose a predefined area of the mechanical layer of silicon. A second via(s) (102) is created in the first or second layers. The least one second via has a depth dimension that is less than a depth dimension of the first via. A metallic trace (70, 72) is applied between the exposed area on the mechanical layer and a portion of the second via. The wafer is sliced such that the second via is separated into two sections, thereby creating a sensor die. The sensor die is then electrically and mechanically bonded to a circuit board at the sliced second via.
Bibliography:Application Number: CN201210139177