Chip through flooring material using PLA resin

• Main Authors: KANG CHANG-WON, KIM JANG-KI, KIM JI-YOUNG, LEE GYEONG-MIN, HUANG CHENG-ZHE, PARK KI-BONG, KWON JUN-HYUK, KWON HYUN-JONG, PARK SANG-SUN
• Format: Patent
• Language: Chinese; English
• Published: 15.08.2012
• Subjects: BUILDING; FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS; FIXED CONSTRUCTIONS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; PERFORMING OPERATIONS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TRANSPORTING

Disclosed is a chip through flooring material using a PLA resin, which is environmentally friendly by using the PLA resin and can realize the texture of natural wood and the unique fragrance of trees. According to the present invention, the chip through flooring material using the PLA resin comprises: a chip through layer; and a surface treatment layer which is formed on a surface of the chip through layer, wherein the chip through layer includes the PLA resin.