Spd films and light valve laminates with improved bus-bar connections

A connection between a power bus and a conducting layer of a suspended particle device in accordance with an embodiment of the present application includes an adhesive combined with metallic particles to impart both good adhesion and electrical conductivity. The adhesive is applied to a surface of t...

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Bibliographic Details
Main Authors SLOVAK STEVEN M, SAXE ROBERT L, WANG DONGYAN
Format Patent
LanguageChinese
English
Published 18.07.2012
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A connection between a power bus and a conducting layer of a suspended particle device in accordance with an embodiment of the present application includes an adhesive combined with metallic particles to impart both good adhesion and electrical conductivity. The adhesive is applied to a surface of the conducting layer. A conducting copper foil or conducting fabric is adhered to the adhesive and forms at least a portion of the power bus.
Bibliography:Application Number: CN201080049286