Wafer level packaging of electronic devices

• Main Authors: PETRONIUS ISRAEL, MARGALIT MORDEHAI
• Format: Patent
• Language: Chinese; English
• Published: 11.07.2012
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An electronic device package constituted of: an electronic device comprising a first contact point; a metal pad disposed to provide electrical connection to the first contact point; a substrate comprising a first face and a second face opposing the first face of the substrate, the first face of the...