Wafer level packaging of electronic devices

An electronic device package constituted of: an electronic device comprising a first contact point; a metal pad disposed to provide electrical connection to the first contact point; a substrate comprising a first face and a second face opposing the first face of the substrate, the first face of the...

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Bibliographic Details
Main Authors PETRONIUS ISRAEL, MARGALIT MORDEHAI
Format Patent
LanguageChinese
English
Published 11.07.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An electronic device package constituted of: an electronic device comprising a first contact point; a metal pad disposed to provide electrical connection to the first contact point; a substrate comprising a first face and a second face opposing the first face of the substrate, the first face of the substrate adjacent a face of the electronic device; and a VIA passing through the substrate from the second face of the substrate to the metal pad, the VIA exhibiting: a pass through extending through the substrate from the first face to the second face; a metal layer disposed within the pass through arranged to provide electrical connectivity to the metal pad from an area adjacent the second face of the substrate; and an electrically insulative first passivation layer disposed between the metal layer and the substrate arranged to provide electrical insulation between the substrate and the metal layer.
Bibliography:Application Number: CN201080041485