Low-dielectric-property polyphenylene sulphide composite material and preparation method thereof

The invention discloses a low-dielectric-property polyphenylene sulphide composite material, comprising the following raw material components in weight proportion: 30-60% of polyphenylene sulphide, 10-50% of glass fiber, 0.5-5% of low-dielectric-property inorganic filler subjected to coupling surfac...

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Bibliographic Details
Main Authors DAI HOUYI, ZHANG ZHIGANG, YU DAHAI, CHEN XINTUO, ZHANG HAITAO, LI YAN, XU WEI, GAO YONG
Format Patent
LanguageChinese
English
Published 11.07.2012
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:The invention discloses a low-dielectric-property polyphenylene sulphide composite material, comprising the following raw material components in weight proportion: 30-60% of polyphenylene sulphide, 10-50% of glass fiber, 0.5-5% of low-dielectric-property inorganic filler subjected to coupling surface treatment, 5-40% of polytetrafluoroethylene and 0.5-5% of compatilizer. Besides, the invention also provides a preparation method of the low-dielectric-property polyphenylene sulphide composite material. Compared with the prior art, the low-dielectric-property polyphenylene sulphide composite material and the preparation method thereof disclosed by the invention have the advantages that the composite material has high and stable mechanical property and electrical insulation property, the processing technology is simple and convenient, the material application field is wide and the like.
Bibliography:Application Number: CN2012101111