Production method for MEMS (micro-electromechanical system) device

• Main Authors: LIU GUOAN, LIU XUANJIE
• Format: Patent
• Language: Chinese; English
• Published: 11.07.2012
• Subjects: MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS; TRANSPORTING

The invention provides a production method for an MEMS (micro-electromechanical system) device, comprising the following steps of: providing a first semiconductor substrate and a second semiconductor substrate, wherein a first groove is formed on the first semiconductor substrate, a second groove is formed on the second semiconductor substrate, and the second groove corresponds to the first groove in position; performing a bonding process to combine the first semiconductor substrate with the second semiconductor substrate and communicate the first groove with the second groove, so as to form an MEMS cavity; filling heat-conducting gas in the MEMS cavity; and performing plasma etching on the first semiconductor substrate above the MEMS cavity filled with the heat-conducting gas, so as to form an MEMS movable device, wherein a through hole is formed between the MEMS movable device and the first semiconductor substrate, and the through hole is communicated with the MEMS cavity. The through hole formed in the pro