Epoxy resin composition for encapsulating semiconductor device and semiconductor device using the same

• Main Authors: LEE EUN-JUNG, LEE YOUNG-KYUN, BAE KYOUNGUL
• Format: Patent
• Language: Chinese; English
• Published: 04.07.2012
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The invention discloses an epoxy resin composition for encapsulating a semiconductor device, a method of encapsulating a semiconductor device, and a semiconductor device, the composition including an epoxy resin; a curing agent; a curing accelerator; an inorganic filler; and a flame retardant; wherein the flame retardant includes boehmite, and is present in an amount of about 0.1 to 20% by weight (wt %), based on a total weight of the epoxy resin composition. The epoxy resin composition displays excellent fire retardancy and enough moulding and reliability, and a fire retardant compound generating a by-product harmful upon the human body and environment during combustion is not needed. [Formula 1] A1O (OH).