Method and device for performing hot embossing of parts by self-polishing die

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Bibliographic Details
Main Authors FU JIANZHONG, ZHAO PENG, CHEN ZICHEN, SHEN HONGYAO, YAO XINHUA, HE YONG
Format Patent
LanguageChinese
English
Published 03.12.2014
Subjects
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
TRANSPORTING
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Bibliography:Application Number: CN2012105290