Brushing device for wafer

• Main Authors: LU XINCHUN, PEI ZHAOHUI, MEI HEGENG, HE YONGYONG
• Format: Patent
• Language: Chinese; English
• Published: 27.06.2012
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a brushing device for a wafer. The brushing device for the wafer comprises a sealed box, a first door body, a strutting piece, a first hair brush and a second hair brush, wherein an accommodating cavity is defined in the sealed box; a wafer taking and placing hole is arranged on a side wall of the accommodating cavity; the first door body is arranged on the side wall and is used for opening and closing the wafer taking and placing hole; the strutting piece is arranged in the accommodating cavity and is used for rotatablely supporting the wafer which is oriented along the vertical direction; the first hair brush and the second hair brush are oppositely arranged in the accommodating cavity at an interval to be respectively used for brushing two surfaces of the wafer. When the wafer is brushed by utilizing the brushing device disclosed by the embodiment of the invention, the wafer can be prevented from being polluted by foreign dirt, so that the cleanliness of the wafer can be greatly imp