Method for manufacturing infrared dynamic scene generation chip
The invention relates to a method for manufacturing an infrared dynamic scene generation chip, belonging to the technical field of dynamic infrared scene generation. The method comprises the following steps of: manufacturing a sacrifice layer on a substrate, forming a PI (Polyimide) thin film on the...
Saved in:
Main Authors | , , , |
---|---|
Format | Patent |
Language | Chinese English |
Published |
13.06.2012
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | The invention relates to a method for manufacturing an infrared dynamic scene generation chip, belonging to the technical field of dynamic infrared scene generation. The method comprises the following steps of: manufacturing a sacrifice layer on a substrate, forming a PI (Polyimide) thin film on the sacrifice layer by utilizing a spin-coating method, manufacturing a pixel array of a visible-light-absorbing infrared radiation layer on the PI thin film, and peeling off the PI thin film by utilizing a corrosion method. The method further comprises the following operation steps of: selecting and cleaning the substrate, manufacturing the sacrifice layer, manufacturing the PI thin film, manufacturing the visible-light-absorbing infrared radiation layer, manufacturing the pixel array, peeling off a thin film chip and fixing the thin film chip. A heat treatment is carried out on the PI thin film during manufacturing, thus the quality of the PI thin film is largely improved. The pixel array is formed by the visible-li |
---|---|
Bibliography: | Application Number: CN20111429609 |