Method for manufacturing infrared dynamic scene generation chip

• Main Authors: HAN JIEPING, LI ZHUO, OU WEN, QIAN LIXUN
• Format: Patent
• Language: Chinese; English
• Published: 13.06.2012
• Subjects: MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS; TRANSPORTING

The invention relates to a method for manufacturing an infrared dynamic scene generation chip, belonging to the technical field of dynamic infrared scene generation. The method comprises the following steps of: manufacturing a sacrifice layer on a substrate, forming a PI (Polyimide) thin film on the sacrifice layer by utilizing a spin-coating method, manufacturing a pixel array of a visible-light-absorbing infrared radiation layer on the PI thin film, and peeling off the PI thin film by utilizing a corrosion method. The method further comprises the following operation steps of: selecting and cleaning the substrate, manufacturing the sacrifice layer, manufacturing the PI thin film, manufacturing the visible-light-absorbing infrared radiation layer, manufacturing the pixel array, peeling off a thin film chip and fixing the thin film chip. A heat treatment is carried out on the PI thin film during manufacturing, thus the quality of the PI thin film is largely improved. The pixel array is formed by the visible-li