Adhesive for chip multilayer ceramic capacitor and preparation method of adhesive

The invention relates to an adhesive for a chip multilayer ceramic capacitor and a preparation method of the adhesive. The adhesive consists of the following components by weight percent: 10-30 percent of polyvinyl butyral resin, 60-80 percent of solvent and 2-10 percent of plasticizer, wherein the...

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Bibliographic Details
Main Authors LI XIAOYU, LU YISEN, CHEN CHANGYUN, WEI HAOREN, ZHU ZHONGYONG, ZHANG YIN, AN KERONG
Format Patent
LanguageChinese
English
Published 02.05.2012
Subjects
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