Adhesive for chip multilayer ceramic capacitor and preparation method of adhesive
The invention relates to an adhesive for a chip multilayer ceramic capacitor and a preparation method of the adhesive. The adhesive consists of the following components by weight percent: 10-30 percent of polyvinyl butyral resin, 60-80 percent of solvent and 2-10 percent of plasticizer, wherein the...
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Main Authors | , , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
02.05.2012
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Subjects | |
Online Access | Get full text |
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