Adhesive for chip multilayer ceramic capacitor and preparation method of adhesive

The invention relates to an adhesive for a chip multilayer ceramic capacitor and a preparation method of the adhesive. The adhesive consists of the following components by weight percent: 10-30 percent of polyvinyl butyral resin, 60-80 percent of solvent and 2-10 percent of plasticizer, wherein the...

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Bibliographic Details
Main Authors LI XIAOYU, LU YISEN, CHEN CHANGYUN, WEI HAOREN, ZHU ZHONGYONG, ZHANG YIN, AN KERONG
Format Patent
LanguageChinese
English
Published 02.05.2012
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:The invention relates to an adhesive for a chip multilayer ceramic capacitor and a preparation method of the adhesive. The adhesive consists of the following components by weight percent: 10-30 percent of polyvinyl butyral resin, 60-80 percent of solvent and 2-10 percent of plasticizer, wherein the molecular weight of the polyvinyl butyral resin is (8 to 12)*104; the solvent comprises aromatic solvent which takes a slightly soluble or swelling effect to resin powder and alcohol or lipid solvent which is used for dissolving the resin powder; and the plasticizer is one to two of phthalic acid ester and dibutyl sebacate. The adhesive can inhibit the poor dispersion of ceramic green diaphragms and can reduce resin particle insoluble substances in the ceramic green diaphragms. When the thickness of each ceramic green diaphragm is below 1-3mum and the number of the layers of the ceramic green diaphragms is increased to 150 to 300, the chip multilayer ceramic capacitor with a good performance can be formed and has t
Bibliography:Application Number: CN20111235345