Method and structure for packaging semiconductor microelectromechanical system (MEMS) chip

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Bibliographic Details
Main Author	XIONG BIFENG
Format	Patent
Language	English
Published	22.04.2015
Subjects	MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING
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Bibliography:	Application Number: CN20111398236