Manufacture method of polyimide film

• Main Authors: HAN JIEPING, WU FENGXIA, LI ZHUO, QIAN LIXUN
• Format: Patent
• Language: Chinese; English
• Published: 15.02.2012
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; WORKING-UP

The method provides a preparation method of a polyimide film. The method employs a spin-coating method to form a PI type polyimide film and utilizes a corrosion method to peel the film. The method comprises steps of: cleaning of a substrate, manufacturing of a corrosive layer, spin-coating of the PI type polyimide film, thermal treatment on the PI type polyimide film, and corrosion peeling of thePI type polyimide film. The substrate, which is always a polished silicon wafer, is thoroughly cleaned with ultrasonic, acetone, ethanol and deionized water; the corrosive layer is a certain materialcorresponding to a corrosive liquid and is processed on a polishing surface of the substrate by a chemical meteorology precipitation or sputtering; the preparation of the PI film is conducted by a spin coater, and a thickness of the PI film is relative to original rubber concentration, a rotating speed of the spin coater, a spin-coating time and thermal treatment parameters, wherein the thermal treatment parameters of the