Manufacture method of polyimide film
The method provides a preparation method of a polyimide film. The method employs a spin-coating method to form a PI type polyimide film and utilizes a corrosion method to peel the film. The method comprises steps of: cleaning of a substrate, manufacturing of a corrosive layer, spin-coating of the PI...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
15.02.2012
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Subjects | |
Online Access | Get full text |
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Summary: | The method provides a preparation method of a polyimide film. The method employs a spin-coating method to form a PI type polyimide film and utilizes a corrosion method to peel the film. The method comprises steps of: cleaning of a substrate, manufacturing of a corrosive layer, spin-coating of the PI type polyimide film, thermal treatment on the PI type polyimide film, and corrosion peeling of thePI type polyimide film. The substrate, which is always a polished silicon wafer, is thoroughly cleaned with ultrasonic, acetone, ethanol and deionized water; the corrosive layer is a certain materialcorresponding to a corrosive liquid and is processed on a polishing surface of the substrate by a chemical meteorology precipitation or sputtering; the preparation of the PI film is conducted by a spin coater, and a thickness of the PI film is relative to original rubber concentration, a rotating speed of the spin coater, a spin-coating time and thermal treatment parameters, wherein the thermal treatment parameters of the |
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Bibliography: | Application Number: CN20111206823 |