Component mounting apparatus

It is an object of the invention to provide an improved component mounting aparatus which is capable of suppressing the occurance of an intermediate stock of boards of a particular kind where components are to be mounted on boards of different kinds which are combined with respective numbers of shee...

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Bibliographic Details
Main Authors KAWAI TAKAYOSHI, HANEDA HIROYUKI, KURODA HIDEYA, YASUI YOSHIHIRO
Format Patent
LanguageChinese
English
Published 08.02.2012
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:It is an object of the invention to provide an improved component mounting aparatus which is capable of suppressing the occurance of an intermediate stock of boards of a particular kind where components are to be mounted on boards of different kinds which are combined with respective numbers of sheets. In a component mounting apparatus, when one of first and second board transfer devices is performing the unloading and loading of boards, a controller operates a component placing device to mount components on a first or second board loaded by the other board transfer device. Thus, it is possible to effectively utilize the time which is taken for the unloading and the loading of either boards, for component mountings on the other board, so that the efficiency in producing boards can be enhanced. Further, since the controller executes a control so that while component mountings are performed on the first boards of M-sheets on the first board transfer device, component mountings are performed on the second boards
Bibliography:Application Number: CN201110196693