Compact molded led module

A method of forming a light emitting diode (LED) module (68) molds an array of lens support frames (42) over an array of connected lead frames (44). LEDs (20, 30) are bonded to the lead frame contacts (12, 14) within the support frames. Molded lenses (48) are then affixed over each support frame, an...

Full description

Saved in:
Bibliographic Details
Main Authors RUDAZ SERGE LAURENT, HAQUE ASHIM SHATIL, BIERHUIZEN SERGE
Format Patent
LanguageChinese
English
Published 18.01.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A method of forming a light emitting diode (LED) module (68) molds an array of lens support frames (42) over an array of connected lead frames (44). LEDs (20, 30) are bonded to the lead frame contacts (12, 14) within the support frames. Molded lenses (48) are then affixed over each support frame, and the lead frames are diced to create individual LED modules (68). In another embodiment, the lenses (80) are molded along with the support frames (82) to create unitary pieces, and the support frames are affixed to the lead frames (72) in the array of connected lead frames. In another embodiment, no lenses are used, and cups (15) are molded with the lead frames (16) so that the LED module (38) is formed solely of the unitary lead frame/cup and the LED. Since each LED enclosure is formed of only one or two separate pieces, and the modules are fabricated on an array scale, the modules can be made very small and simply.
Bibliography:Application Number: CN201080008581