Position measuring system and method for assembly

A method for mounting a substrate of a measurement graduation and a scanning head of a position measuring system on a first machine part and a second machine part. The method including fastening a substrate of a measurement graduation and a scanning head on first and second portions, respectively, o...

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Bibliographic Details
Main Authors PUCHER WOLFGANG, KUEHLER MARKUS
Format Patent
LanguageChinese
English
Published 11.01.2012
Subjects
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PHYSICS
TESTING
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Summary:A method for mounting a substrate of a measurement graduation and a scanning head of a position measuring system on a first machine part and a second machine part. The method including fastening a substrate of a measurement graduation and a scanning head on first and second portions, respectively, of a mounting aid. The method including adjusting a location of the first portion relative to the second portion in a first degree of freedom that differs from a measurement direction in which a relative position of the first machine part relative to the second machine part is to be measured. The method including fastening the substrate and the scanning head on the first and second machine parts, respectively, at the mounting position. The method further including removing the mounting aid.
Bibliography:Application Number: CN201110186200