Hot melt transfer resin composition and preparation method thereof
The invention discloses a hot melt transfer resin composition and a preparation method thereof, belonging to the field of adhesive preparation. The resin composition comprises polyester polyol, tackifying resin, polyethylene wax powder and organic solution, wherein, the polyester polyol is obtained...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
02.11.2011
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Subjects | |
Online Access | Get full text |
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Summary: | The invention discloses a hot melt transfer resin composition and a preparation method thereof, belonging to the field of adhesive preparation. The resin composition comprises polyester polyol, tackifying resin, polyethylene wax powder and organic solution, wherein, the polyester polyol is obtained by esterification and polycondensation of m-phthalic acid, 1, 4 succinic acid, sebacic acid, glycol and neopentylene glycol, and has a hydroxyl value of 5-15mgKOH/g, an acid ester of 0.1-0.9mgKOH/g and a rotational viscosity of 60000-80000mPa.s at the temperature of 80 DEG C. The melting temperature of the hot melt transfer resin composition is controlled within the range of 180-200 DEG C, so that the hot melt transfer resin composition has low melt viscosity and fast thermal transferring. Because the high glass transition temperature of the composition, non-adhesion in the rolling process after coating is realized, and strong scratch resistance of the decorative surface after transfer printing is obtained. |
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Bibliography: | Application Number: CN20111127547 |