Shell of electronic device and manufacturing method of shell

The invention discloses a shell of an electronic device and a manufacturing method of the shell. A film provided with a washout protection sheet is arranged in die. A plastic is injected into the die from an injection port to form the shell, and the washout protection sheet corresponds to the inject...

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Bibliographic Details
Main Author CAI SHENGYOU
Format Patent
LanguageChinese
English
Published 19.10.2011
Subjects
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES
INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Summary:The invention discloses a shell of an electronic device and a manufacturing method of the shell. A film provided with a washout protection sheet is arranged in die. A plastic is injected into the die from an injection port to form the shell, and the washout protection sheet corresponds to the injection port. After the shell is formed, the washout protection sheet is integrated with the plastic.
Bibliography:Application Number: CN20101148606