Circuit board and formation method thereof

The invention provides a circuit board and a formation method thereof. The circuit board comprises: a substrate; at least one conductive pad which is arranged on the substrate; a protection layer which is arranged on the substrate and possesses at least one opening to at least expose parts of the co...

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Bibliographic Details
Main Author LIN XIANJIE
Format Patent
LanguageChinese
English
Published 05.10.2011
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The invention provides a circuit board and a formation method thereof. The circuit board comprises: a substrate; at least one conductive pad which is arranged on the substrate; a protection layer which is arranged on the substrate and possesses at least one opening to at least expose parts of the conductive pad; a conductive connecting block which is filling in the opening and is electrically connected to the conductive pad; a pictured conductive metal layer which is arranged on the conductive connecting block and is electrically contacted with the conductive connecting block. Wherein, the pictured conductive metal layer is completely arranged on the opening of the protection layer. The circuit board is provided with conductive convex blocks with fine spacing and precisely controllable volumes. The conductive convex blocks can be integrated with chips which possess high wiring density and small volume.
Bibliography:Application Number: CN20101158418