Light-emitting diode (LED) packaging structure for promoting heat dissipation effect and manufacturing method thereof

• Main Authors: XIAO SONGYI, WANG BINGLONG
• Format: Patent
• Language: Chinese; English
• Published: 21.09.2011
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a light-emitting diode (LED) packaging structure for promoting a heat dissipation effect and a manufacturing method thereof. The method comprises the following steps: firstly, providing a base plate element; then removing partial base plate element so as to form at least two base plate bodies and at least one gap, wherein the two base plate bodies are separated with each other, and the gap is formed between the two base plate bodies; next, forming at least one insulation layer in at least one gap so that the two base plate bodies are connected with each other through at least one insulation layer; next, positioning at least one light-emitting element on one of base plate bodies; subsequently, electrically connecting at least one light-emitting element between the two base plate bodies; and finally, forming at least one packaging gum on at least two base plate bodies and at least one insulation layer for covering at least one light-emitting element.