Organosilicon copolymer composites, method of manufacture, and articles formed therefrom

Organosilicon composites are described, comprising 30 to 90 vol.% of a cured organosilicon copolymer derived by curing an organosilicon polymer having, in the same copolymer, silicon-containing repeating units comprising a silicon hydride and silicon-containing repeating units comprising a C1-10 eth...

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Bibliographic Details
Main Author PAUL SANKAR K
Format Patent
LanguageChinese
English
Published 14.09.2011
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
GENERAL PROCESSES OF COMPOUNDING
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PERFORMING OPERATIONS
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
WORKING-UP
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Summary:Organosilicon composites are described, comprising 30 to 90 vol.% of a cured organosilicon copolymer derived by curing an organosilicon polymer having, in the same copolymer, silicon-containing repeating units comprising a silicon hydride and silicon-containing repeating units comprising a C1-10 ethylenically unsaturated group; and 10 to 70 vol.% of a dielectric filler. The composites are used inthe manufacture of circuit subassemblies.
Bibliography:Application Number: CN200980140940