Composite member

Disclosed is a composite member suitable as a heat-dissipating member for a semiconductor element. Also disclosed is a process for producing the composite member. The composite member is a complex of magnesium or a magnesium alloy and SiC and has a void ratio of less than 3%. The composite member is...

Full description

Saved in:
Bibliographic Details
Main Authors NAKAI YOSHIHIRO, NISHIKAWA TAICHIRO, KUSAKARI MISATO, IWAYAMA ISAO, TAKAKI YOSHIYUKI, IKEDA TOSHIYA
Format Patent
LanguageChinese
English
Published 31.08.2011
Subjects
ALLOYS
CASTING
CASTING OF METALS
CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
CHEMISTRY
FERROUS OR NON-FERROUS ALLOYS
METALLURGY
PERFORMING OPERATIONS
POWDER METALLURGY
TRANSPORTING
TREATMENT OF ALLOYS OR NON-FERROUS METALS
Online AccessGet full text

Cover

More Information
Summary:Disclosed is a composite member suitable as a heat-dissipating member for a semiconductor element. Also disclosed is a process for producing the composite member. The composite member is a complex of magnesium or a magnesium alloy and SiC and has a void ratio of less than 3%. The composite member is produced by forming an oxide film on the surface of a raw material SiC, placing the coated SiC having the oxide film formed thereon in a template, and infiltrating a molten metal (magnesium or a magnesium alloy) into the coated SiC aggregate. The wettability of SiC with the molten metal can be increased by forming the oxide film, whereby the void ratio of the composite member can be reduced. The process enables the production of a composite member having excellent thermal properties including a thermal expansion coefficient of 4 to 10 ppm/K inclusive and a heat conductivity of 180 W/m*K or more.
Bibliography:Application Number: CN200980139128