Mold release film

The invention provides a mold release film, which is formed by a crystalline polyester (A) layer configured to be at a surface layer and a lamination film of a polyester layer, crystallization or melting heat of the (A) layer is 35-50 J/g, and an indicator of crystallization speed is smaller than 50...

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Bibliographic Details
Main Author KENYU KIKO
Format Patent
LanguageChinese
English
Published 13.07.2011
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
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Summary:The invention provides a mold release film, which is formed by a crystalline polyester (A) layer configured to be at a surface layer and a lamination film of a polyester layer, crystallization or melting heat of the (A) layer is 35-50 J/g, and an indicator of crystallization speed is smaller than 50 degrees. Crystallization or melting heat of the (B) layer is 20-40 J/g, and an indicator of crystallization speed is smaller than 60 degrees.
Bibliography:Application Number: CN20101530122