Waterbased formaldehyde free adhesives

There is described a formaldehyde-free laminating adhesive, optionally the with less than 3% by weight of co-solvent(s), the adhesive comprising: (I) a polyurethane that comprises from 30 % to 65 % by weight of hard segments, the polyurethane being obtained and/or obtainable from a first polyurethan...

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Main Authors TENNEBROEK RONALD, ZAMBEEK MARCEL, SLOT VAN DER SASKIA CAROLIEN, OVERBEEK GERARDUS CORNELIS, AABICH MOURAD
Format Patent
LanguageChinese
English
Published 15.06.2011
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Summary:There is described a formaldehyde-free laminating adhesive, optionally the with less than 3% by weight of co-solvent(s), the adhesive comprising: (I) a polyurethane that comprises from 30 % to 65 % by weight of hard segments, the polyurethane being obtained and/or obtainable from a first polyurethane dispersion (PUD) comprising the reaction product of (A) an organic isocyanate and (B) at least one chain extender reacting in a respective stoichiometric ratio (NCO to NCO reactive group) from 1:1 to 1:2.5 and; optionally the NCO reactive group(s) of the chain extender comprises one or more hydrazinyl-like group(s) (denoting isocyanate reactive groups selected from the group comprising, preferably consisting of: -NRNR2(hydrazinyl groups); -CONRNR2 (hydrazidyl groups), -NRCONRNR2 (semicarbazidyl groups); and -ONR2 (oxyamine groups), where each R is independently selected from H or C1-10hydrocarbo); and (II) optionally a second polymer obtained and/or obtainable from a polymer precursor comprising at least one unsa
Bibliography:Application Number: CN20098127749