Process kit component for sputtering chamber
The invention provides a process kit component for a sputtering chamber. The sputtering chamber has a sputtering target comprising a backing plate and a sputtering plate. The backing plate has a groove. The sputtering plate comprises a cylindrical mesa having a plane, and an inclined annular rim sur...
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Main Authors | , , , , |
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Format | Patent |
Language | Chinese English |
Published |
08.06.2011
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Subjects | |
Online Access | Get full text |
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Abstract | The invention provides a process kit component for a sputtering chamber. The sputtering chamber has a sputtering target comprising a backing plate and a sputtering plate. The backing plate has a groove. The sputtering plate comprises a cylindrical mesa having a plane, and an inclined annular rim surrounding the cylindrical mesa. In one version, the backing plate is constituted of a material having a high thermal conductivity and a low electric resistance. In another version, the backing plate includes a back face having a single groove or a plurality of grooves. A process kit for the sputtering chamber is equipped with a deposition ring, a cover ring and a shield assembly, being placed about a substrate support in the sputtering chamber. |
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AbstractList | The invention provides a process kit component for a sputtering chamber. The sputtering chamber has a sputtering target comprising a backing plate and a sputtering plate. The backing plate has a groove. The sputtering plate comprises a cylindrical mesa having a plane, and an inclined annular rim surrounding the cylindrical mesa. In one version, the backing plate is constituted of a material having a high thermal conductivity and a low electric resistance. In another version, the backing plate includes a back face having a single groove or a plurality of grooves. A process kit for the sputtering chamber is equipped with a deposition ring, a cover ring and a shield assembly, being placed about a substrate support in the sputtering chamber. |
Author | HONG ILYOUNG RICHARD RITCHIE ALAN ALEXANDER DONNY YOUNG SCHEIBLE KATHLEEN A KELKAR UMESH |
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Notes | Application Number: CN201110036072 |
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Snippet | The invention provides a process kit component for a sputtering chamber. The sputtering chamber has a sputtering target comprising a backing plate and a... |
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SubjectTerms | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
Title | Process kit component for sputtering chamber |
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