Process kit component for sputtering chamber

• Main Authors: SCHEIBLE KATHLEEN A, KELKAR UMESH, HONG ILYOUNG RICHARD, RITCHIE ALAN ALEXANDER, DONNY YOUNG
• Format: Patent
• Language: Chinese; English
• Published: 08.06.2011
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The invention provides a process kit component for a sputtering chamber. The sputtering chamber has a sputtering target comprising a backing plate and a sputtering plate. The backing plate has a groove. The sputtering plate comprises a cylindrical mesa having a plane, and an inclined annular rim surrounding the cylindrical mesa. In one version, the backing plate is constituted of a material having a high thermal conductivity and a low electric resistance. In another version, the backing plate includes a back face having a single groove or a plurality of grooves. A process kit for the sputtering chamber is equipped with a deposition ring, a cover ring and a shield assembly, being placed about a substrate support in the sputtering chamber.