Scrubbing device for wafer

The invention discloses a scrubbing device for a wafer, which comprises a frame, a supporting part, a washing-liquid supply unit and a pair of brushes, wherein the supporting part is arranged on the frame to support the wafer; the washing-liquid supply unit is arranged on the frame and used for appl...

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Bibliographic Details
Main Authors LU XINCHUN, PEI ZHAOHUI, LUO JIANBIN, MEI HEGENG, HUANG YATING, HE YONGYONG
Format Patent
LanguageChinese
English
Published 14.11.2012
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Summary:The invention discloses a scrubbing device for a wafer, which comprises a frame, a supporting part, a washing-liquid supply unit and a pair of brushes, wherein the supporting part is arranged on the frame to support the wafer; the washing-liquid supply unit is arranged on the frame and used for applying a washing liquid to the surface of the wafer; and the pair of brushes comprises a brush main body and a plurality of hair bundles arranged on the surface of the brush main body, the pair of brushes is rotatably arranged on the frame to clamp the wafer between the brushes, and the torque for driving the wafer to rotate is generated on the wafer while the surface of the wafer is scrubbed. According to the scrubbing device for the wafer disclosed by the embodiment of the invention, the wafer is driven to rotate by the torque generated to the wafer by the brushes, so that a wafer driving device does not need to be additionally arranged, the structure is simple and reliable, and the designing and manufacturing cost
Bibliography:Application Number: CN20101272672