Wireless communication module and manufacturing method thereof

• Main Author: LIAO GUOXIAN
• Format: Patent
• Language: Chinese; English
• Published: 04.05.2011
• Subjects: ANTENNAS, i.e. RADIO AERIALS; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

The invention provides a wireless communication module and a manufacturing method thereof. The wireless communication module comprises a substrate unit, a circuit component, a first package unit, an electromagnetic interference (EMI) protective film, a second package unit, an antenna and a conducting component, wherein, the substrate unit is provided with grounding parts and electrical contacts; the circuit component is arranged on the substrate unit and is electrically connected with the electrical contacts; the first package unit coats the circuit component and the electrical contacts are exposed; the EMI protective film covers the first package unit and is electrically connected with the grounding parts; the second package unit covers the EMI protective film and the electrical contacts are exposed; the antenna is formed on the second package unit; and the conducting component is electrically connected with the electrical contacts and the antenna through the first package unit and the second package unit.