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Summary:In-plane temperature of each substrate is uniformly controlled at the time of heating, at the same time, substrates placed on a plurality of susceptors, respectively. A heat treatment apparatus is provided with a plurality of susceptors (120), i.e., conductive members for placing wafers thereon, having an induction heating body (122) electrically divided into a center portion (126) and a peripheral portion (124) thereof; a quartz boat (112) which supports the susceptors in a row; an induction coil (130), which is arranged inside a treatment chamber (102) to surround the circumference of each susceptor and configured such that the temperature of the induction coil can be freely adjusted; and a control section (300) which performs temperature control by changing the ratio between a heat value at the center portion of the induction heating body and that at the peripheral portion, by controlling high frequency currents at two frequencies to be applied to the induction coil from a high frequency current circuit (2
Bibliography:Application Number: CN200980114031