Polyurethane foam and polishing pad

Disclosed is a polyurethane foam which has hardness and elasticity suitable for polishing pads, while having low specific gravity. A polishing pad using the polyurethane foam is also disclosed. The polyurethane foam is obtained by reacting a blended composition containing (A) a polyisocyanate, (B) a...

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Bibliographic Details
Main Authors HABA SHIN-ICHI, KAWAI NORIO, YOSHIDA KOUICHI, GOTO MICHIRO, TAKEMOTO KAZUO, OOSHIMA NOBUYUKI
Format Patent
LanguageChinese
English
Published 13.04.2011
Subjects
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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Summary:Disclosed is a polyurethane foam which has hardness and elasticity suitable for polishing pads, while having low specific gravity. A polishing pad using the polyurethane foam is also disclosed. The polyurethane foam is obtained by reacting a blended composition containing (A) a polyisocyanate, (B) a polyol, (C) a chain extender having a molecular weight of not more than 400 and (D) water. As the component (A), MDI is mainly blended in the blended composition, and the blending amount of the MDI is 45-70 parts by weight when the total weight of the components (A), (B) and (C) is taken as 100 parts by weight.
Bibliography:Application Number: CN20098114547