Copper powder for conductive paste, and conductive paste

A copper powder for a conductive paste contains 0.1 atm%-10 atm% of Si (silicon) and 0.1 atm%-10 atm% of In in the particle.  It is preferable that the copper powder for a conductive paste contains 0.1 atm%-10 atm% of Ag (silver) in the particle.  It is also preferable that the copper powder for a c...

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Bibliographic Details
Main Authors MIYAKE KOICHI, OTA KOYU, YOSHIMARU KATSUHIKO, UWAZUMI YOSHIAKI, KURIMOTO TORU
Format Patent
LanguageChinese
English
Published 12.06.2013
Subjects
ALLOYS
BASIC ELECTRIC ELEMENTS
CABLES
CAPACITORS
CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
CASTING
CHEMISTRY
CONDUCTORS
ELECTRICITY
FERROUS OR NON-FERROUS ALLOYS
INSULATORS
MAKING METALLIC POWDER
MANUFACTURE OF ARTICLES FROM METALLIC POWDER
METALLURGY
PERFORMING OPERATIONS
POWDER METALLURGY
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
TRANSPORTING
TREATMENT OF ALLOYS OR NON-FERROUS METALS
WORKING METALLIC POWDER
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Summary:A copper powder for a conductive paste contains 0.1 atm%-10 atm% of Si (silicon) and 0.1 atm%-10 atm% of In in the particle.  It is preferable that the copper powder for a conductive paste contains 0.1 atm%-10 atm% of Ag (silver) in the particle.  It is also preferable that the copper powder for a conductive paste contains 0.01 atm%-0.5 atm% of P (phosphorus).  The ratio of Si/In (atm ratio) is preferably 0.5-5.  The copper powder for a conductive paste is preferably manufactured by an atomization method.
Bibliography:Application Number: CN200980114457