Organometallic-compound feeder

• Main Author: ABE TOSHIMITSU
• Format: Patent
• Language: Chinese; English
• Published: 23.02.2011
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

An organometallic-compound feeder comprising a container into which an organometallic compound which is solid at ordinary temperature is packed. A carrier gas is supplied to the container to sublimate the organometallic compound. The feeder is characterized by further having: a holding plate which has been disposed in the container and which holds the organometallic compound deposited on an inertsupport and permits the carrier gas to pass therethrough; a carrier gas inlet disposed in an upper part of the container; a carrier gas outlet which is open in an area located in a bottom part of thecontainer and under the holding plate; and a baffle which has been attached between the holding plate and the carrier gas outlet and is larger than the aperture of the carrier gas outlet. The feeder is further characterized in that the carrier gas is passed downward from above through the organometallic compound packed on the holding plate and deposited on the inert support.