Substrate lamination system and method

A method for laminating substrates may include disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate, disposing the first substrate, the pressure-sensitive adhesive layer, and the second subs...

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Bibliographic Details
Main Authors BARNIDGE TRACY J, TCHON JOSEPH L, SAMPICA JAMES D, MARZEN VINCENT P, NEMETH PAUL R
Format Patent
LanguageChinese
English
Published 09.02.2011
Subjects
BASIC ELECTRIC ELEMENTS
DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FREQUENCY-CHANGING
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
NON-LINEAR OPTICS
OPTICAL ANALOGUE/DIGITAL CONVERTERS
OPTICAL LOGIC ELEMENTS
OPTICS
PERFORMING OPERATIONS
PHYSICS
SEMICONDUCTOR DEVICES
TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
TRANSPORTING
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Summary:A method for laminating substrates may include disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate, disposing the first substrate, the pressure-sensitive adhesive layer, and the second substrate within a vacuum chamber, evacuating the vacuum chamber, and applying a pressure to at least one of the first substrate and the second substrate.
Bibliography:Application Number: CN200980107294