Opto-electronic chip structure and opto-electronic element

• Main Author: YUANG RONG-HENG
• Format: Patent
• Language: Chinese; English
• Published: 28.11.2012
• Subjects: BASIC ELECTRIC ELEMENTS; DEVICES USING STIMULATED EMISSION; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS; SEMICONDUCTOR DEVICES

An opto-electronic element includes a base and an opto-electronic wafer. The opto-electronic wafer has a conductive pedestal and a wafer layer is located on one side of the conductive pedestal. Two electrodes are electrically connected with the wafter layer or the conductive pedestal and arranged on the same side. The base includes a metal plate body and an insulated structure matched. A plurality of pins are arranged on the metal plate body or the insulated structure in group. The opto-electronic wafer is located on the insulated structure and isolated from pins, and the wafer and base are kept in an insulated state. Furthermore, an auxiliary pin for supporting the opto-electronic wafer and for forming an open circuit or serving as an electrode of the opto-electronic wafer is located in an axial direction of the insulated structure. The combination of the metal plate body and insulated structure may be replaced with a non-metal plate body with a corresponding shape, and a periphery of the non-metal plate bod