Method for manufacturing gallium nitride based light-emitting diode with high light extracting efficiency
The invention discloses a method for manufacturing a gallium nitride based light-emitting diode with high light extracting efficiency, comprising the following steps of: providing a sapphire substrate; sequentially growing an N-GaN layer, a light-emitting layer and a P-GaN layer on the substrate; et...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
19.09.2012
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Subjects | |
Online Access | Get full text |
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Summary: | The invention discloses a method for manufacturing a gallium nitride based light-emitting diode with high light extracting efficiency, comprising the following steps of: providing a sapphire substrate; sequentially growing an N-GaN layer, a light-emitting layer and a P-GaN layer on the substrate; etching part of a surface with the P-GaN layer through a photomask etching process till the N-GaN layer is exposed; plating a transparent conductive layer on the P-GaN layer and the exposed N-GaN layer for forming an ohmic contact; removing part of the transparent conductive layer through a wet etching method to separate the transparent conductive layers on the P-GaN layer from the exposed N-GaN layer; respectively manufacturing a P-electrode and an N-electrode on the separated transparent conductive layers through a photomask etching process; and cutting the substrate into a plurality of light-emitting diode chips by grinding and thinning the substrate. The LED chips manufactured through themethod avoid the light ab |
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Bibliography: | Application Number: CN20101259994 |