Printed wiring board and manufacturing method of the same

• Main Author: WASHIMA MINEO
• Format: Patent
• Language: Chinese; English
• Published: 17.11.2010
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

An object of the present invention is to provide the printed wiring board capable of forming fine conductor patterns easily and with high precision, simplifying the manufacturing method and reducing the manufacturing cost. The manufacturing method includes the steps of: forming a base metal pattern on a surface of an insulating substrate; coating the surface with a negative photoresist, where the metal pattern is formed; forming a plating resist pattern on the insulating substrate in such a way that the insulating substrate is irradiated with light so as to transmit therethrough from a surface of the opposite side to the surface of the insulating substrate, and the negative photoresist of a part, where the base metal pattern is not formed, is irradiated with the transmitted light and is exposed with the base metal patterns as a self-alignment mask, and thereafter is developed; and forming a metal pattern selectively on the base metal pattern by plating the surface of the base metal pattern of a part where the