Structure for packing semiconductor device, method for packing semiconductor device, and embossed tape

• Main Authors: TOYOSAWA KENJI, KUDOSE SATORU
• Format: Patent
• Language: Chinese; English
• Published: 29.02.2012
• Subjects: ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; BASIC ELECTRIC ELEMENTS; CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; CONVEYING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HANDLING THIN OR FILAMENTARY MATERIAL; PACKAGES; PACKAGING ELEMENTS; PACKING; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; STORING; TRANSPORTING

Disclosed is a packing structure of a TAB tape (100) wherein the TAB tape (100) and a conductive embossed tape (200) are wound on a conductive reel. The TAB tape has a plurality of semiconductor chips (103) bonded on a film (101) whereupon wiring patterns are repeatedly formed. The embossed tape has emboss sections (202) continuously formed on one side of a film (201) in the longitudinal direction. The TAB tape (100) and the embossed tape (200) are wound on the reel by making the bonding surface of the semiconductor chip (103) on the film (101) face the protruding surfaces of the embossed sections (202) of the film (201). When the thickness of the semiconductor chip (103) is t(0.2<=t<=0.625)mm and the thickness of the film (201) is substantially 0.125mm, the total thickness of the embossed tape (200) is (t+0.4)mm or more but not more than 1.1mm. Thus, while sufficiently ensuring protection of the TAB tape for shipping and transportation, the TAB tape can be packed by a desired take-upquantity.