Method of manufacturing an inspection apparatus for inspecting an electronic device

In a method of manufacturing an inspection apparatus for inspecting an electronic device, a sacrificial substrate is formed into a substrate pattern including a through-hole. A principal substrate including an internal wiring penetrating from a first surface to a second surface thereof is combined w...

Full description

Saved in:
Bibliographic Details
Main Authors HWANG JI-HEE, HA JUNG-MIN, CHOI WOOANG, OH SUNG-JAE, LEE YONG-JI
Format Patent
LanguageChinese
English
Published 15.09.2010
Subjects
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
Online AccessGet full text

Cover

More Information
Summary:In a method of manufacturing an inspection apparatus for inspecting an electronic device, a sacrificial substrate is formed into a substrate pattern including a through-hole. A principal substrate including an internal wiring penetrating from a first surface to a second surface thereof is combined with the substrate pattern in such a configuration that the through-hole is positioned over the internal wiring, thereby forming a combined structure. A filling structure is formed in the through-hole of the substrate pattern, and the filling structure is electrically connected to the internal wiring of the principal substrate. The substrate pattern is removed from the combined structure, and thus the filling structure is formed into a probe structure on the principal substrate. The probe structure may be connected to the principal substrate without any adhesives such as a solder, to thereby prevent electrical resistance increase and excessive thermal stress.
Bibliography:Application Number: CN200880112709