Implanted bioelectrode based on photoetching and other micro-nano manufacturing technologies and preparation method thereof

• Main Authors: DING YUCHENG, DU RUKUN, WANG HUIYOU, BAI ZONGXU, LIU YAXIONG, QIN GE
• Format: Patent
• Language: Chinese; English
• Published: 15.09.2010
• Subjects: APPARATUS THEREFOR; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; ELECTROTHERAPY; HUMAN NECESSITIES; HYGIENE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MAGNETOTHERAPY; MEDICAL OR VETERINARY SCIENCE; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; RADIATION THERAPY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; ULTRASOUND THERAPY

The invention discloses an implanted bioelectrode based on photoetching and other micro-nano manufacturing technologies and a preparation method thereof. As for the bioelectrode, a metal core wire is coated with an insulating sleeve provided with a spiral metal lead, the spiral metal lead and the insulating sleeve are encapsulated in a polyurethane insulating layer, and an excitation point and a connection end metal ring are respectively connected with the spiral metal lead reserved at the two ends; and the surface of the excitation point is electroplated with inert metal oxides. The technology deposits a layer of metal membrane on the polyurethane insulating sleeve by sputtering or evaporation; the deposited metal membrane is manufactured into an initial spiral structure by the technologies of photoetching, micro contact stamping and etching; the final spiral metal lead is shaped by electro-deposited metal; the sleeve penetrated by the metal core wire is placed in an encapsulating die for encapsulation; a la