Method for fabricating electrical bonding pads on a wafer

Method for fabricatingelectrical bonding pads of a wafer Method for fabricatingelectrical bonding pads on the electrical contact areas of a wafer, comprising the productionof first blocks (7) made of a solder material, the productionof second blocks(10) made of a solder material on these first block...

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Bibliographic Details
Main Authors PROVENT GIL, COFFY ROMAIN, SEILLER JACKY
Format Patent
LanguageChinese
English
Published 04.04.2012
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:Method for fabricatingelectrical bonding pads of a wafer Method for fabricatingelectrical bonding pads on the electrical contact areas of a wafer, comprising the productionof first blocks (7) made of a solder material, the productionof second blocks(10) made of a solder material on these first blocks, and passage through an oven so as to shape the said blocks into approximately domed electrical bonding pads.
Bibliography:Application Number: CN200880104797