Sensible heat composition for positive thermosensitive CTP plate without preheating and plate-making method by using same

• Main Authors: JIANG XIANGYU, XIE JIAN, YU SHANGXIAN, GU JIANGNAN, NING GUOGUANG, YANG YAN, ZHONG KEXI, YANG JINRUI
• Format: Patent
• Language: Chinese; English
• Published: 16.06.2010
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY; LINING MACHINES; MATERIALS THEREFOR; ORIGINALS THEREFOR; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTING; PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTINGSURFACES; STAMPS; TRANSPORTING; TYPEWRITERS

The invention relates to a sensible heat composition for a thermosensitive CTP (Computer to Plate) plate. The thermosensitive composition comprises a perether compound of one or more low molecular phenolic compounds as a dissolution inhibitor or a solutizer, and the molecular weight of the low molecular phenolic compound is 100-400. Furthermore, the invention also relates to a method for preparing the positive thermosensitive CTP plate without preheating. The method comprises the following steps of: (1) sequentially carrying out rough treatment, anodic oxidation treatment and sealing treatment on an aluminum plate base; (2) carrying out plate coating on the aluminum plate base through the sealing treatment by using the thermosensitive CTP (Computer to Plate) plate; (3) carrying out two-section drying on the coated aluminum plate base obtained in the step (2), wherein the first section is dried by using a far infrared ray to heat, while the second section is dried by using forced hot blast, thereby obtaining t