Combined type film coating device and method

• Main Authors: LIN HANLUN, LV KUNDA
• Format: Patent
• Language: Chinese; English
• Published: 16.06.2010
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The invention discloses a combined type film coating device and a combined type film coating method, which is used for evenly forming a film above a substrate. The device comprises a vacuum chamber and a rotor; the vacuum cavity is provided with a sputtering chamber and an evaporation chamber; the sputtering chamber can carry out plasma surface processing on the substrate and can sputter the membrane conducting layer; the evaporation chamber is connected in the sputtering chamber and is used for evaporating a leading electrical layer; the substrate is rotated in the sputtering chamber and the evaporation chamber by the rotor; the sputtering membrane conducting layer is alternated on the leading electrical layer; and the leading electrical layer is evaporated on the membrane conducting layer until reaching the preset membrane thickness.