Preparation method of copper and indium alloy ink and application thereof

• Main Authors: WANG LEI, CHEN GUANBI, YANG DEREN
• Format: Patent
• Language: Chinese; English
• Published: 25.05.2011
• Subjects: BASIC ELECTRIC ELEMENTS; CASTING; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MAKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; PERFORMING OPERATIONS; POWDER METALLURGY; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE; TRANSPORTING; WORKING METALLIC POWDER

The invention discloses a preparation method of a copper and indium alloy ink, comprising the following steps: (1) dissolving copper chloride and indium chloride in ethylene glycol at 80-200 DEG C, then slowing dropwise adding ethylene glycol solution of sodium borohydride for reaction; carrying out centrifuge, washing and drying to obtain copper and indium alloy nanoparticles; (2) preparing solution according to volume ratio: ethylene glycol: methanol: ethylene glycol methyl ether=2-8: 1:2-6; (2) dispersing the copper and indium alloy nanoparticles obtained in step (1) according to mass ratio: copper and indium alloy nanoparticles : solvent=1 : 2-8 and evenly dispersing the mixture by ultrasonic waves to obtain the copper indium alloy ink. The invention also discloses an application method of the copper and indium alloy ink in preparing sulphur indium copper film or selenium indium copper film. In the invention, a low-cost chemical method is adopted to synthesize copper and indium alloy nanoparticles, the pr