Chip pick-and-place control method and device

• Main Authors: CAI WEILIN, WANG YUHUI, CHEN JIANKUI, YIN ZHOUPING, XIONG YOULUN
• Format: Patent
• Language: Chinese; English
• Published: 10.08.2011
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a chip pick-and-place control method, wherein a chip pick-and-place device is switched to a low speed from a high speed directly in the descending process to reduce the impact force in the decelerating process and effectively finish the picking or the placing of a chip. A device for implementing the method comprises a supporting mechanism, a straight-line motion mechanism, a rotary motion mechanism, a spline and a chip pick-and-place mechanism, wherein the two motion mechanisms drive the spline to perform straight-line motions and rotary motions respectively; the splineis connected with the chip pick-and-place mechanism and is provided with an elastic component; and a straight-line driving mechanism can be restored by the elastic force of the elastic component. Therotary motion mechanism serves as an auxiliary shaft, and the motion of the auxiliary shaft is attached to the straight-line driving mechanism through a transmission mechanism so that the auxiliary shaft can accurately run for