Electrical interconnect structure and method of forming the same

An electrical structure and method of forming. The electrical structure includes a first substrate comprising a first- electrically conductive pad, a second substrate comprising a second electricallyconductive pad, and an interconnect structure electrically and mechanically connecting the first elec...

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Bibliographic Details
Main Authors NAH JAE-WOONG, GRUBER PETER ALFRED, FURMAN BRUCE KENNETH, SHIH DA-YUAN, BUCHWALTER STEPHEN LESLIE
Format Patent
LanguageChinese
English
Published 17.02.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An electrical structure and method of forming. The electrical structure includes a first substrate comprising a first- electrically conductive pad, a second substrate comprising a second electricallyconductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect. structure comprises a non-solder metallic core structure with a cylindrical or spherical shape, a first solder structure, and a second solder structure.. The first solder structure electrically and mechanically connects a first portion of the non- solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non- solder metallic core structure to the second electrically conductive pad.
Bibliography:Application Number: CN200880011580