Chip cooling device

• Main Authors: LI JUN, YING JI, XU LIANG, LIN XIEZHAO
• Format: Patent
• Language: Chinese; English
• Published: 10.02.2010
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a chip cooling device which comprises a cooling room positioned at the bottom of the device and matched with the chip, a cooling liquid pond stored with cooling liquid, a firstmicro channel, a first micro pump, a second micro channel, a micro nozzle, a third micro channel, a second micro pump, a fourth micro channel, a condenser and a micropore, wherein one end of the first micro pump is communicated with the cooling liquid pond by the first micro channel and the other end is communicated with the micro nozzle by the second micro channel; the micro nozzle is arranged above the cooling room and communicated with the cooling room; one end of the second micro pump is communicated with the cooling room by the third micro channel and the other end is communicated with the condenser by the fourth micro channel; the condenser is positioned above the cooling liquid pond and a condensing channel is arranged in the interior of the condenser; and a radiating fin is arranged on the top of the cond